new Intel Core i5-10400F i5 10400F 2.9 GHz Six-Core Twelve-Thread CPU Processor 65W LGA1200 but no fan

Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number  ? 

CPU part numbers

• CM8070104282719 is an OEM/tray microprocessor

• CM8070104290716 is an OEM/tray microprocessor

• BX8070110400F is a boxed processor (English version)

• BXC8070110400F is a boxed processor (Chinese version)

Frequency  ? 

2900 MHz

Maximum turbo frequency

4300 MHz (1 core)
4000 MHz (all cores)

Low power frequency

800 MHz

Bus speed  ? 

8 GT/s DMI

Clock multiplier  ? 

29

Package

1200-land Flip-Chip Land Grid Array

Socket

Socket 1200

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

April 30, 2020

Price at introduction

$157 (OEM)
$155 (box)

Microarchitecture

Comet Lake

Processor core  ? 

Comet Lake-S

Core steppings  ? 

G1 (SRH3D)
Q0 (SRH79)

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

6

The number of threads

12

Floating Point Unit

Integrated

Level 1 cache size  ? 

6 x 32 KB 8-way set associative instruction caches
6 x 32 KB 8-way set associative data caches

Level 2 cache size  ? 

6 x 256 KB 4-way set associative caches

Level 3 cache size

12 MB 16-way set associative shared cache

Physical memory

128 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• BMI / BMI1 + BMI2 / Bit Manipulation instructions

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• EM64T / Extended Memory 64 technology / Intel 64  ? 

• HT / Hyper-Threading technology  ? 

• VT-x / Virtualization technology  ? 

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0  ? 

Security Features

• NX / XD / Execute disable bit  ? 

• MPX / Memory Protection Extensions

• SGX / Software Guard Extensions

• SMAP / Supervisor Mode Access Prevention

• SMEP / Secure Mode Execution Protection

Low power features

• Core C1/C1E, C3, C6, C7, C8, C9 and C10 states

• Package C3, C6, C7, C8, C9 and C10 states

• Enhanced SpeedStep technology  ? 

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels (per controller): 2
Memory channels (total): 2
Channel width (bits): 64
Supported memory: DDR4-2666
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 42.7

Other peripherals

• Direct Media Interface 3.0 (4 lanes)

• PCI Express 3.0 interface (16 lanes)

Minimum/Maximum operating temperature  ? 

0°C (case) – 71.3°C (case)
100°C (junction)

Thermal Design Power  ? 

65 Watt