Intel Xeon E3-1270 E3 1270 3.4 GHz Quad-Core CPU Processor 8M 80W LGA 1155

General information

Type

CPU / Microprocessor

Market segment

Server

Family

Intel Xeon E3-1200

Model number  ? 

E3-1270

CPU part numbers

• CM8062307262403 is an OEM/tray microprocessor

• BX80623E31270 is a boxed microprocessor

Frequency  ? 

3400 MHz

Maximum turbo frequency

3800 MHz (1 core)
3700 MHz (2 cores)
3600 MHz (3 cores)
3500 MHz (4 cores)

Bus speed  ? 

5 GT/s DMI

Clock multiplier  ? 

34

Package

1155-land Flip-Chip Land Grid Array (FCLGA 1155)

Socket

Socket 1155 / H2 / LGA1155

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

Apr 3, 2011

End-of-Life date

Last order date is December 27, 2013
Last shipment date for tray processors is December 5, 2014

Price at introduction

$328

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Sandy Bridge

Platform

Bromolow

Processor core  ? 

Sandy Bridge

Core stepping  ? 

D2 (Q1HW, SR00N)

CPUID

206A7 (SR00N)

Manufacturing process

0.032 micron High-K metal gate process

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size  ? 

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size  ? 

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Features

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• EM64T / Extended Memory 64 technology / Intel 64  ? 

• NX / XD / Execute disable bit  ? 

• HT / Hyper-Threading technology  ? 

• VT-x / Virtualization technology  ? 

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0  ? 

• TXT / Trusted Execution technology

Low power features

• C1, C3 and C6 thread states

• C1/C1E, C3 and C6 core states

• C1/C1E, C3 and C6 package states

• Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes

Other peripherals

• Direct Media Interface 2.0

• PCI Express 2.0 interface

Electrical / Thermal parameters

Minimum/Maximum operating temperature  ? 

5°C – 69.1°C

Minimum power dissipation

5.5 Watt (C6 state)

Thermal Design Power  ? 

80 Watt