Intel Xeon E3-1265L v3 NEW E3 1265LV3 E3 1265L V3 2.5 GHz Quad-Core CPU Processor L3=8M 45W LGA 1150

General information

Type

CPU / Microprocessor

Market segment

Server

Family

Model number  ? 

CPU part number

• CM8064601467406 is an OEM/tray microprocessor

Frequency ? 

2500 MHz

Maximum turbo frequency

3700 MHz (1 core)
3100 MHz (4 cores)

Bus speed ? 

5 GT/s DMI

Package

1150-land Flip-Chip Land Grid Array

Socket

Socket 1150 / H3 / LGA1150

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

June 2, 2013 (launch)
June 4, 2013 (announcement)

Price at introduction

$294

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Haswell

Platform

Denlow

Processor core  ? 

Haswell LGA1150

Core stepping  ? 

C0 (QE6M, QEJ4, SR15A)

Manufacturing process

0.022 micron

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size  ? 

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Features

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• BMI / BMI1 + BMI2 / Bit Manipulation instructions

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• TSX / Transactional Synchronization Extensions

• EM64T / Extended Memory 64 technology / Intel 64  ? 

• NX / XD / Execute disable bit  ? 

• HT / Hyper-Threading technology  ? 

• TBT 2.0 / Turbo Boost technology 2.0  ? 

• VT-x / Virtualization technology  ? 

• VT-d / Virtualization for directed I/O

• TXT / Trusted Execution technology

Low power features

• Core C1/C1E, C3 and C6 states

• Package C1/C1E, C3 and C6 states

• Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Integrated graphics

GPU Type: HD (Haswell)
Graphics tier: GT1
Microarchitecture: Gen 7.5
Execution units: 10
Base frequency (MHz): 350
Maximum frequency (MHz): 1200
The number of supported displays: 3

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 25.6
ECC supported: Yes

Other peripherals

• Direct Media Interface 2.0

• PCI Express 3.0 interface

Electrical / Thermal parameters

Thermal Design Power ? 

45 Watt